Semiconductor Packaging News
网页TSMC and Amkor have partnered to bring advanced chip packaging to the U.S., marking a milestone in American efforts to boost domestic semiconductor capabilities. This collaboration will support key clients like Nvidia, AMD, and Apple, accelerating U.S. chip production and innovation. Nikkei Asia. Samsung chairman debunks foundry, chip biz ...
Semiconductor Packaging News
网页The semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
Semiconductor Packaging News
网页Semiconductor Engineering. Intel's struggles hit Biden’s Chips and Science Act with a gut punch. Intel's financial struggles pose a serious threat to President Biden's Chips and Science Act. With Intel potentially shifting to chip design, America's ambition to produce 20% of global leading-edge chips by 2030 is at risk.
Is Chip Packaging the New Front on the US-China CHIP WARS?
网页Scott Foster's Asia Times article emphasizes that advanced IC packaging is the new battleground in the U.S.-China chip wars. While U.S. sanctions target IC production, China's stronghold on back-end packaging complicates restriction efforts. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
Semiconductor Packaging News Index
网页Oct 8, 2024. SUMMARY. EDA And IP Revenue Grow, But Markets Are Shifting Worldwide EDA and IP revenue surged 18.2% to $4.69 billion in Q2 2024. While China's IP revenue grew 20%, EDA ... Semiconductor Engineering.
Semiconductor Packaging News
网页China chip-packaging giant JCET takes over Shanghai plant of US flash memory maker SanDisk. Chinese chip-packaging giant JCET has acquired an 80% stake in SanDisk's Shanghai plant for $624 million, boosting its position in the global semiconductor industry. The deal enhances JCET's data storage capabilities and strengthens its partnership with ...
Semiconductor Packaging News Technical Paper Index
网页Jul 31, 2024. Advanced Packaging for Next-Generation Vehicle. Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ... Amkor Technology, Inc.
Global Semiconductor Sales Increase 20.6% Year-to-Year in August
网页4 天之前 · Global Semiconductor Sales Increase 20.6% Year-to-Year in August. Global semiconductor sales surged to $53.1 billion in August 2024, marking a 20.6% year-over-year increase and 3.5% rise from July. This growth was led by a 43.9% jump in sales to the Americas. The dedicated team at Semiconductor Packaging News has provided this summary for your ...
CHIPS Subsidy Boosts Advanced Packaging in U.S.
网页A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this summary for your ...
Intel Glass Core Substrate Update - Semiconductor Packaging News
网页Intel Glass Core Substrate Update. INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus on glass core substrates, integral to their Advanced Packaging roadmap unveiled in September 2023.