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EDN
4 小时
Calories, power dissipation, and environmental chambers
John Dunn’s observation on the relationship between calories, body's heat dissipation, and how this can impact an ...
EDN
6 小时
A closer look at LLM’s hyper growth and AI parameter explosion
The rapid evolution of artificial intelligence (AI) has been marked by the rise of large language models (LLMs) with ...
EDN
1 天
Microvolts to kilovolts in milliseconds with one I/O pin
You can use the LMC555 and an RC network go from 0.01 V to 1000 V using one I/O pin, you just have to find a resistor rated ...
EDN
1 天
A beginner’s guide to power of IQ data and beauty of negative frequencies – Part 2
Part 2 of this DI series presents a device that allows you to play with and display live SDR signal spectrums with negative ...
EDN
1 天
The rise of MCU-enabled sensor designs
Here is how MCUs are setting in motion a transformation in sensor designs serving consumer, industrial, and IoT applications.
EDN
3 天
Nvidia, TSMC, and advanced packaging realignment in 2025
Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
EDN
7 天
Tamron’s TAP-in Console: A nexus for camera lens update and control
Specifically, today’s teardown victim is a Tamron TAP-in Console, this particular model intended for the Canon EF mount used ...
EDN
7 天
Add one resistor to allow DAC control of switching regulator output
Modifying the oddly consistent two-resistor control network topology for output voltage programming to allow for DAC control.
EDN
2 天
Multi-solar panel interconnections: Mind the electrons’ directions
Solar panels can simplistically be thought of as batteries. But batteries can also be the solar panels’ undoing. Confused? Read on!
EDN
6 天
GaN RF switch delivers 20 W
Built on a GaN HEMT process, Teledyne’s TDSW84230EP reflective SPDT switch covers 30 MHz to 5 GHz, handling 20 W of ...
EDN
7 天
How TMDs can transform semiconductor manufacturing
Transition metal dichalcogenides (TMDs) possess numerous properties beneficial to semiconductor device manufacturing.
EDN
6 天
EDA tool tackles 3D IC design challenges
GENIO EVO, an integrated chiplet/package EDA tool, addresses thermal and mechanical stress in the pre-layout stage of 3D IC ...
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