President Volodymyr Zelenskyy's proposal to start supplying Ukrainian coal for electricity generation to Transnistria is ...

Researchers have built a deep-ultraviolet microscope to study hard-to-analyze materials like diamond, offering a new way to ...

The Samsung Galaxy S25 series sets a new standard as a true AI companion with most natural and context-aware mobile ...

Muscat: A competitive process for the procurement of two gas-based Independent Power Projects (IPPs), boasting an aggregate ...

Advanced Chip and Circuit Materials Inc. (ACCM), a US-based manufacturer of skew free, ultra-thin copper-clad laminates and dielectric prepreg materials used to fabricate high layer count PTH, Buildup ...

The integration of nanomaterials in aerospace thermal management improves thermal insulation and barrier coatings, ensuring ...

DS Smith presented a new fibre-based, temperature-controlled packaging solution at PharmaPack Europe 2025 - highlighting its ...

RCM Technologies Inc., RCM Thermal Kinetics, a division of RCM Technologies, has launched its innovative New Ethanol ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Ultrawide-bandgap semiconductors—such as diamond—are promising for next-generation electronics due to a larger energy gap ...