Semiconductor Packaging News
ASML share plunge wipes over $50 billion off Dutch chip giant's value. ASML shares plunged 16% after releasing disappointing sales forecasts, wiping out €48.7 billion in market value. The semiconductor equipment maker's weak outlook dragged down …
Semiconductor Packaging News Index
Semiconductor Engineering. Oct 18, 2024. SUMMARY. 3D Packaging in Semiconductors Increased Trend for of Electric Devices Drives Demand. The global 3D semiconductor packaging market, valued at $11 billion in 2023, is projected to reach $57.19 billion by 2034, ... Times Tech.
Semiconductor Packaging News
The semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
Biden-Harris Administration Opens Funding Competition for Up to …
1 天前 · The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S. This investment aims to enhance performance and competitiveness …
Semiconductor Packaging News
China chip-packaging giant JCET takes over Shanghai plant of US flash memory maker SanDisk. Chinese chip-packaging giant JCET has acquired an 80% stake in SanDisk's Shanghai plant for $624 million, boosting its position in the global semiconductor industry. The deal enhances JCET's data storage capabilities and strengthens its partnership with ...
Is Chip Packaging the New Front on the US-China CHIP WARS?
Scott Foster's Asia Times article emphasizes that advanced IC packaging is the new battleground in the U.S.-China chip wars. While U.S. sanctions target IC production, China's stronghold on back-end packaging complicates restriction efforts. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
3D Packaging in Semiconductors Increased Trend for of Electric …
4 天之前 · 3D Packaging in Semiconductors Increased Trend for of Electric Devices Drives Demand. The global 3D semiconductor packaging market, valued at $11 billion in 2023, is projected to reach $57.19 billion by 2034, growing at a 16.17% CAGR. Asia Pacific leads the market, while North America sees rising demand in high-performance computing and ...
Chip Industry Week In Review
1 天前 · Chip Industry Week In Review. Summary. Arm partnered with Samsung Foundry, ADTechnology, and Rebellions to develop a cutting-edge AI CPU chiplet platform using Samsung's 2nm technology. Meanwhile, Intel and AMD formed an x86 ecosystem advisory group, and Samsung launched high-speed GDDR7 DRAM for data centers. Semiconductor Engineering.
How Big A Deal Is Aging? - semiconductorpackagingnews.com
4 天之前 · How Big A Deal Is Aging? Semiconductor aging is raising concerns in safety-critical markets like automotive, as newer nodes magnify aging effects. Experts emphasize the need for conservative design, thorough analysis, and additional margins to ensure reliability, with stress factors like voltage and temperature accelerating degradation.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this summary for your ...