Reactive-ion etching - Wikipedia
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field.
Recent Advances in Reactive Ion Etching and Applications of High ... - MDPI
2021年8月20日 · This paper will review deep high-aspect-ratio reactive ion etching technologies for silicon, fused silica (quartz), glass, silicon carbide, compound semiconductors and piezoelectric materials.
Reactive Ion Etching (RIE) - SpringerLink
Reactive ion etching (RIE) is a plasma process where radiofrequency (RF) discharge-excited species (radicals, ions) etch substrate or thin films in a low-pressure chamber. RIE is a synergistic process between chemically active species and energetic ion bombardment.
Deep Reactive Ion Etching - an overview | ScienceDirect Topics
Deep reactive ion etching is a highly anisotropic etch process used to create high-aspect-ratio silicon structures and intricate morphologies, both with tight tolerances in a repetitive and controllable fashion.
Reactive ion etching - LNF Wiki - University of Michigan
2021年10月26日 · Reactive ion etching (RIE) is a high resolution mechanism for etching materials using reactive gas discharges. It is a highly controllable process that can process a wide variety of materials, including semiconductors, dielectrics and some metals.
Reactive Ion Etching - Atomic Layer Processing - Wiley Online …
2021年4月28日 · In reactive ion etching (RIE), many species such as neutrals, radicals, ions, electrons, and photons impact the surface simultaneously and continuously. This chapter introduces mechanisms that are unique to RIE.
Reactive Ion Etching or RIE, systems and processes | CORIAL
Reactive ion etching (RIE) is a type of plasma etch technology used in specialty semiconductor markets for device manufacturing. Chemically reactive species (ions) are accelerated toward the substrate (usually a silicon wafer), to remove a specific deposited material.
Deep reactive ion etching - ScienceDirect
2020年1月1日 · Reactive ion etching (RIE), also known as plasma etching or dry etching, and its extension deep RIE (DRIE) are processes that combine physical and chemicals effects to remove material from the wafer surface.
Reactive Ion Etching (RIE) | Stanford Nanofabrication Facility
Reactive ion etchers are parallel plate, capacitively coupled plasma etchers wherein the substrate sits on the powered electrode. An RF power, in most cases at 13.56MHz, is applied to the powered electrode. The powered electrode area is typically smaller than …
Reactive Ion Etching (RIE): Precise Nanoscale Patterning for
Reactive Ion Etching (RIE) combines chemical reactions and physical ion bombardment to etch nanoscale features with high precision, enabling the fabrication of integrated circuits, MEMS, and photonic devices.