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Semiconductor Engineering
3 天
Improving The Gate Oxide Reliability in Gate First HKMG DRAM Structures (Sungkyunkwan Univ ...
A new technical paper titled “Novel STI Technology for Enhancing Reliability of High-k/Metal Gate DRAM” was published by ...
Semiconductor Engineering
3 天
Security Concerns Weigh Down Open-Source EDA
Open-source EDA tools are free, readily available, and growing in numbers, but many chipmakers are wary of using them due to ...
Semiconductor Engineering
6 天
Government Chip Funding Spreads Globally
Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.
Semiconductor Engineering
6 天
EDA And IP Revenue Grow, But Markets Are Shifting
Overall numbers mask some regional pockets of strength and weakness. EDA and IP revenue grew 18.2% worldwide to $4.69 billion ...
Semiconductor Engineering
2 个月
Chip Industry Week In Review
More nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; SDV challenges; EDA, IP, and chip sales up; ML ...
Semiconductor Engineering
3 天
Confidential Computing: A Key To Secure Cloud And Edge Environments
The foundation of the TEE is called a Root of Trust (RoT), which is based on a secure key unique to each processor. The ...
Semiconductor Engineering
10 天
Partitioning In The Chiplet Era
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal ...
Semiconductor Engineering
3 天
Challenges In Reducing Wireless Latency
New protocols and technology will spur a whole new wave of chips, but those designs will be significantly more complicated.
Semiconductor Engineering
3 天
Lightweight, High-Performance CPU Extension for Protected Key Handles with CPU-Enforced ...
A Lightweight ISA Extension for Protected Key Handles with CPU-enforced Usage Policies” was published by researchers at CISPA ...
Semiconductor Engineering
5 天
Research Bits: Oct. 8
Materials: Soft, flexible polymer semiconductors; photonic topological phase transition; solving the mystery of aluminum ...
Semiconductor Engineering
3 天
Chiplet-Level HI of Polymer-Based Circuits For Fabricating Flexible Electronic-Photonic ...
A technical paper titled “Flexible electronic-photonic 3D integration from ultrathin polymer chiplets” was published by ...
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