Siltronic's H1 2024 sales declined by 14%, with EBITDA suffering even more due to lower volumes and increased fixed costs.

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and ...

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...

Taiwan Semiconductor ramps up 2nm tech despite challenges. Price for 2nm wafers to double, highlighting its moat. TSM eyes ...

The full release from Canon Inc. can be found here. Optional products including a wafer handling system for special ...

Substrate and epi-wafer shipments from the company at 350 micron and 500 micron thickness are now underway. As a dedicated manufacturer of both SiC substrates and epitaxial wafers, Coherent ...

glass substrates, chip-on-wafer-on-substrate (CoWoS), and silicon photonics integration. Generative AI applications are rapidly expanding, transitioning from cloud-based services to edge deployments.

Taiwan Semiconductor Manufacturing Company (TSMC) has signed an advanced semiconductor packaging and testing deal with ...

TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test ...