Siltronic's H1 2024 sales declined by 14%, with EBITDA suffering even more due to lower volumes and increased fixed costs.

SiC power MOSFET structure using a cost-effective engineered substrate (thin high quality monocrystalline SiC layer bonded ...

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and ...

--GROWTH GUIDANCE: TSMC raised its guidance for full-year revenue growth to slightly above mid-20% in U.S. dollar terms after a strong second quarter. Investors will look for the company's latest 2024 ...

The rapid development of the global generative AI market is driving unprecedented transformation in the semiconductor ...

Taiwan Semiconductor Manufacturing Company Ltd. TSM is scheduled to report third-quarter 2024 results on Oct. 17. Stay ...

announced today the launch of its 200 mm silicon carbide epitaxial wafers (SiC epi-wafers). Substrate and epi-wafer shipments from the company at 350 micron and 500 micron thickness are now underway.

announced today the launch of its 200 mm silicon carbide epitaxial wafers (SiC epi-wafers). Substrate and epi-wafer shipments from the company at 350 micron and 500 micron thickness are now underway.