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8 小时
Siltronic: Exposure To AI, Amid Chip Recovery (Rating Upgrade)
Siltronic's H1 2024 sales declined by 14%, with EBITDA suffering even more due to lower volumes and increased fixed costs.
Semiconductor Engineering
1 天
Metrology Advances Step Up To Sub-2nm Device Node Needs
Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and ...
Digi Times
9 天
TSMC's three-pronged strategy: Outsourcing CoWoS to Amkor as US plant exceeds expectations
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...
Digi Times
14 天
NEWS TAGGED SIC SUBSTRATE
Spirox and its subsidiary Southport have unveiled a new SiC substrate testing system, which is now being tested in collaboration with customers such as GlobalWafers and Wafer Works... Thursday 26 ...
Taiwan News
1 天
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor ...
For advanced IC substrate applications, direct imaging represents a new category beyond steppers for lithography. KLA is ...
12 天
What's Going On With Taiwan Semiconductor Stock On Friday?
Taiwan Semiconductor ramps up 2nm tech despite challenges. Price for 2nm wafers to double, highlighting its moat. TSM eyes ...
insideHPC
12 天
Amkor and TSMC Collaborate on Advanced Packaging in Arizona
TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test ...
Yahoo Finance
12 天
Canon Inc. Releases FPA-3030i6 Semiconductor Lithography System for Small Wafers
The full release from Canon Inc. can be found here. Optional products including a wafer handling system for special ...
RCR Wireless News
12 天
TSMC, Amkor strike chip packaging deal at planned US plant
Taiwan Semiconductor Manufacturing Company (TSMC) has signed an advanced semiconductor packaging and testing deal with ...
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