A tree fell on a 12-year-old New Jersey boy while he was playing outside in the yard with friends, killing him.

Six people were taken to hospital after the incident on a residential street in the early hours of Wednesday morning.

TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it ...

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and ...

Wolfspeed has reached a preliminary agreement with the U.S. Commerce Department for $750 million in government grants to support its new North Carolina silicon carbide wafer manufacturing plant.

The race is on to implement wafer stacking and die-to-wafer hybrid bonding, now considered essential for stacking logic and memory, 3D NAND, and possibly multi-layer DRAM stacks in HBMs. Vertical ...

That's about $8 billion more than a 3nm fab. Furthermore, the estimated per-wafer cost presents a 50 percent increase over ...

Georgia Tech’s ECE undergrads design custom mixed-signal ASICs that are then fabricated by Texas Instruments on 300-mm wafers ...

Its growing market share in wafer fab equipment (WFE ... Similarly, Applied has a strong lead in die-stacking technologies that enable high-bandwidth memory (HBM), which is essential for AI ...