A tree fell on a 12-year-old New Jersey boy while he was playing outside in the yard with friends, killing him.

9月21日，由张江高科、芯谋研究联合主办的张江高科·芯谋研究（第十届）集成电路产业领袖峰会在上海浦东圆满举行。本届峰会为近年来行业里规格最高的国际半导体产业峰会，来自ST、AMD、华为、中芯国际、华虹、华润微、长存、蔚来等知名国际国内企业的300多位 ...

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and ...

The race is on to implement wafer stacking and die-to-wafer hybrid bonding, now considered essential for stacking logic and memory, 3D NAND, and possibly multi-layer DRAM stacks in HBMs. Vertical ...

A mother-of-two has died after her ottoman bed collapsed on her head and suffocated her. Helen Davey, 39, was killed whilst ...

TSMC's N2 (2nm-class) manufacturing technology promises to provide numerous advantages over existing N3 (3nm-class) ...

That's about $8 billion more than a 3nm fab. Furthermore, the estimated per-wafer cost presents a 50 percent increase over ...

Wolfspeed has reached a preliminary agreement with the U.S. Commerce Department for $750 million in government grants to support its new North Carolina silicon carbide wafer manufacturing plant.

Taiwan's TSMC has inked a deal with US semiconductor outfit Amkor Technology to beef up advanced chip packaging on American ...