But going vertical comes at a cost, which has left chipmakers scrambling to find ways to reduce wafer-edge defects. Those defects significantly impede the ability to yield all die on the wafer, and ...

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and ...

Wafer Inspection Market. The wafer inspection market will experience significant growth with a robust CAGR of 10.6% during ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending ...

Of course, no manufacturing technology is perfect and the intricate process of fabricating semiconductor chips inevitably ...

In a study published in the journal ACS Applied Materials and Interfaces. Dr. Kyung Tae Kim of KIMS’ Nano Materials Research ...

Researchers from Australian National University and Chinese PV module manufacturer Longi investigated the wafer quality of n-type industrial ingots made via the Recharged Czochralski (RCz) process ...

Larger wafer sizes often mean more defects and potentially higher costs, driving the need for inspection equipment to find defects early and help prevent low-yield wafers. If Semi's forecast is ...

Researchers tested for chemicals in Langstone Harbour, Hampshire, which is home to harbour seals and a diverse range of birds.

The profit margin assured by high purity silicon wafers, innovative chip designs, and “zero-defect” chip fabrication ...

Apple is said to be thinking of implementing a new chip packaging technology with the introduction of its first 2nm chipsets.