defect-free 300mm wafers. To better control wafer-edge defects throughout fab processing, and for fusion and hybrid bonding, engineers are fine tuning new and existing processes. These include a ...

But cryo etch presents some intriguing options, even if it’s unclear whether the industry can bring it into production. What is etch? Etch, the process step that etches or removes materials from the ...

German chipmaker Infineon has successfully developed the world’s first 300mm power gallium nitride (GaN) wafers. The company said that the breakthrough will help to boost the market for GaN-based ...

Description: JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) ...

While wafer thickness appears to be gradually unifying, wafer size and shape is a different story. Between 2013 and 2017, 156 mm “M0” and 156.75 mm “M2” wafers dominated the market upon ...

There are five important characteristics to consider in selecting any dry etch process. These are rate, feature profiles, compositional selectivity, damage and uniformity across the wafer. In general ...

The PlasmaPro 100 process modules from Oxford Instruments provide a 200 mm platform with multi-wafer batch capability and a single wafer. The process modules provide high precision, high throughput, ...

Its electronic chemicals segment provides wet process chemicals to the semiconductor industry, to clean and etch silicon wafers in the production of semiconductors. Its wood preserving chemicals ...

Typically, the exposed photoresist (hit by the light) is washed off, creating a ‘stencil’ on the silicon wafer. Subsequent machines etch away ... more gates than the horizontal approach.

The Nordson DAGE 4300 bondtester complements the proven semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and ...