The solar industry has dragged its heels on the issue of silver-dependence for cell metallization, but China’s Jiangsu ...
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024A seed layer is then placed on top of the barrier to enable copper electroplating ... and Intel is tackling that in both standard silicon designs and using new 2D materials.
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