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Semiconductor Engineering
10 天
What’s Next For Through-Silicon Vias
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...
Hackaday
1 年
Copper Coating 3D Prints
Using a process known as mechanical plating or peen plating, he deposits a layer of copper on a PLA print. The results look good, as you can see in the video below. This isn’t electroplating ...
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