Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production ...

German chipmaker Infineon has successfully developed the world’s first 300mm power gallium nitride (GaN) wafers. The company said that the breakthrough will help to boost the market for GaN-based ...

It had the most 200mm wafer capacity last year and ranked second, trailing only Samsung, in 300mm wafer capacity. It is not surprising that the 300mm ranking includes only DRAM and NAND flash memory ...

Those defects significantly impede the ability to yield all die on the wafer, and the need to bond wafers together calls for incredibly flat, defect-free 300mm wafers. To better control wafer-edge ...

A 300mm semiconductor wafer, which is the maximum wafer size in use as of 2024. Although 18-inch (450mm) wafers have been developed, the billions in cost to change all the chip-making machinery in ...

registering an all-time high in wafer starts added. The 8.7% jump in IC industry capacity forecast for 2022 will come primarily from the addition of 10 new 300mm wafer fabs that are scheduled to open ...

The Nordson DAGE 4300 bondtester complements the proven semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and ...

Another is reliably fabricating chips using these materials across a 300mm wafer, the standard size for chip fabrication. Also, chip design relies on two different types of transistor. Making ...

Infineon has developed 300mm power GaN wafers which deliver 2.3x more ICs per wafer than 200mm. “This remarkable success is the result of our innovative strength and the dedicated work of our global ...

On the other hand, GlobalWafers distinguishes itself through effective cost control and its monopoly in the US market, thanks to its investment in a new 300mm wafer plant in Texas. “It is the ...

Texas Instruments (NASDAQ:TXN) said it signed a tentative agreement with the U.S. Department of Commerce to receive up to $1.6B in proposed direct funding to support three 300mm wafer fabs under ...