Because thin wafer handling and processing is such a challenge, most chipmakers use temporary bonding of wafers to glass wafers for support during processing. “Most people are bonding to a glass wafer ...

A 300mm semiconductor wafer, which is the maximum wafer size in use as of 2024. Although 18-inch (450mm) wafers have been developed, the billions in cost to change all the chip-making machinery in ...

lithography equipment called "argon fluoride lithography machine," with core technical specifications of "300mm wafer diameter, 248nm illumination wavelength, resolution below 65nm, and alignment ...

NXP's partnership with Vanguard to build a 300mm wafer manufacturing facility in Singapore could add $4 billion in incremental revenue. Inventory destocking in the automotive semi market is ...

New figures suggest that global spending on 300mm fab equipment is expected to reach a record $400 billion from 2025 to 2027. The research from SEMI and highlighted in its quarterly 300mm Fab Outlook ...

The focus on 300mm wafer technology and internal manufacturing will reduce costs by 40%, providing a competitive edge over peers like Intel and TSMC. TXN's premium valuation is justified by its ...

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization of ...

Texas Instruments (NASDAQ:TXN) said it signed a tentative agreement with the U.S. Department of Commerce to receive up to $1.6B in proposed direct funding to support three 300mm wafer fabs under ...

MILPITAS — Global spending on 300mm fab equipment is expected to reach US$400 billion from 2025 to 2027, SEMI highlighted in its quarterly 300mm Fab Outlook Report to 2027 report.

Worldwide, 300mm fab equipment spending is projected to grow by 4% to US$99.3 billion in 2024, and further increase by 24% to US$123.2 billion in 2025, surpassing the US$100 billion level for the ...

The company will now proceed with the planned construction of VSMC’s first 300mm wafer manufacturing facility. VIS and NXP announced on June 5 this year plans to establish the VSMC joint venture ...

Global spending on 300mm fab equipment is expected to reach a record $400 billion from 2025 to 2027, SEMI highlighted in its quarterly 300mm Fab Outlook Report to 2027 report. The robust spending is ...